Ping You Industrial Co.,Ltd

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Ping You Industrial Co.,Ltd

Oubel 500g No Clean Lead Free Solder Paste For Screen Stencil Printing

    • Oubel 500g No Clean Lead Free Solder Paste For Screen Stencil Printing
    • Oubel 500g No Clean Lead Free Solder Paste For Screen Stencil Printing
  • Oubel 500g No Clean Lead Free Solder Paste For Screen Stencil Printing

    Product Details:

    Place of Origin: China
    Brand Name: PY
    Model Number: PY38800KF

    Payment & Shipping Terms:

    Minimum Order Quantity: 1pcs
    Price: Negotiation
    Packaging Details: Box
    Delivery Time: 1-7Day
    Supply Ability: 1000
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    Detailed Product Description
    Paste: Lead Free Solder Paste For Screen Stencil Printing Place Of Origin:: Guangdong, China (Mainland)
    Application:: Most Of The Case Of Soldering Opration Ingredient:: Tin Silver Copperand Flux
    Name: Silver Solder Paste

    Oubel 500g no clean lead free solder paste for screen stencil printing

    Detailed Product Description

    1. Introduction:

    Sn99Ag0.3Cu0.7: 500g per box;100g/pc,10kg per carton; melting point:227deg

    Paste designed for soldering SMD components in production processes that do not include washing phase.

    It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres .

    The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface.

    It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.

    Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.

    The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.

    2. Chemical Component Data Sheet:

    Sort Chemical composition (wt.%)
    Sn Pb Sb Cu Bi Ag Fe Al Cd
    Sn96.5Ag3.0Cu0.5 Bal. < 0.10 <0.10 0.5±0.1 <0.10 3.0±0.05 <0.02 <0.002 <0.002

     

     

    3. Physical Properties:

     

     

    Sort Melting Point (℃) Spec. Gravity (g/cm3) Tensile Strength (MPa)
    Sn96.5-Ag3.0-Cu0.5 217-219 7.40 53.
     

     

    4. Our Superiority is the Professionalism of our team.

     

    - PCB And PCB Assembly For One-stop Service with Original Components According the BOM.

     

    IC Imported from Digikey / Farnell etc.

     

    - Low Cost with High Quality, Commitment of Quality Assurance.

     

    - For 10 years Experience in PCB Field. ( Our Factory owns advanced

     

    production equipment and experienced technical personnel. )

     

     

    5. Detailed specification of manufaturing capacity:

     

    NO Item Craft Capacity
    1 Layer 1-30 Layers
    2 Base Material for PCB FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material
    3 Rang of finish baords Thickness 0.21-7.0mm
    4 Max size of finish board 900MM*900MM
    5 Minimum Linewidth 3mil (0.075mm)
    6 Minimum Line space 3mil (0.075mm)
    7 Min space between pad to pad 3mil (0.075mm)
    8 Minimum hole diameter 0.10 mm
    9 Min bonding pad diameter 10mil
    10 Max proportion of drilling hole and board thickness 1:12.5
    11 Minimum linewidth of Idents 4mil
    12 Min Height of Idents 25mil
    13 Finishing Treatment HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
    14 Soldermask Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
    15 Minimun thickness of soldermask 10um
    16 Color of silk-screen White, Black, Yellow ect.
    17 E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing
    18 Other test ImpedanceTesting,Resistance Testing, Microsection etc.,
    19 Date file format GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
    20 Special technological requirement Blind & Buried Vias and High Thickness copper
    21 Thickness of Copper 0.5-14oz (18-490um)

     

     

    6. Quote Requirements for PCB and PCB Assembly project:

     

    - Gerber File and Bom List;

     

    - Quote Quantity;

     

    - Advise your technical requirements for quoting reference;

     

    - Clearly picturers of PCB or PCB Assembly Sample to us for reference;

     

    - Test Mothod for PCB Assembly.

     

    7. T-SOAR Factory Silhouette:

     

    Contact Details
    Ping You Industrial Co.,Ltd

    Contact Person: Ms. Becky Lee

    Send your inquiry directly to us (0 / 3000)