All Products
-
Andrew LodgeWe just receive the machine and it is with nice packing ! It's really be worth this price . -
Mareks AsarsMachine works well, Alex is the best salesman i ever met,thx for your support.
-
Adrian ShortThe JUKI feeders arrived yesterday and we inspected them through our Goods Receiving process. Our inspector was very excited and called me to see them
Contact Person :
Becky Lee
Phone Number :
86-13428704061
WhatsApp :
+8613428704061
Oubel 500g No Clean Lead Free Solder Paste For Screen Stencil Printing
| Place of Origin | China |
|---|---|
| Brand Name | PY |
| Model Number | PY38800KF |
| Minimum Order Quantity | 1pcs |
| Price | Negotiation |
| Packaging Details | Box |
| Delivery Time | 1-7Day |
| Supply Ability | 1000 |
Contact me for free samples and coupons.
WhatsApp:0086 18588475571
Wechat: 0086 18588475571
skype: sales10@aixton.com
If you have any concern, we provide 24-hour online help.
xProduct Details
| Paste | Lead Free Solder Paste For Screen Stencil Printing | Place Of Origin | Guangdong, China (Mainland) |
|---|---|---|---|
| Application | Most Of The Case Of Soldering Opration | Ingredient | Tin Silver Copperand Flux |
| Name | Silver Solder Paste | ||
| High Light | silver solder paste,no clean solder paste |
||
Product Description
Oubel 500g no clean lead free solder paste for screen stencil printing
Detailed Product Description
1. Introduction:
Sn99Ag0.3Cu0.7: 500g per box;100g/pc,10kg per carton; melting point:227deg
Paste designed for soldering SMD components in production processes that do not include washing phase.
It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres .
The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface.
It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.
Our Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste adopts the alloy which is formed by the 96.5% tin, the 3% silver, and the 0.5% copper. This product is desirable for the reflow soldering process which has relatively high demand. Its working temperature can be divided into three types. The preheat temperature varies from 130 degrees Celsius to 170 degrees Celsius. The melting temperature is 217 degrees Celsius, and the reflow temperature ranges from 250 degrees Celsius to 240 degrees Celsius.
The Sn96.5Ag3.0Cu0.5 SAC305 lead free silver solder paste has passed the SGS test, and achieved multiple certifications, including RoHS, REACH, and some others. Our lead-free solder cream has been exported to Germany, Russia and Spain. Moreover, we are looking for agents on a global scale. Please contact us, if you show interest in our product.
2. Chemical Component Data Sheet:
| Sort | Chemical composition (wt.%) | ||||||||
| Sn | Pb | Sb | Cu | Bi | Ag | Fe | Al | Cd | |
| Sn96.5Ag3.0Cu0.5 | Bal. | < 0.10 | <0.10 | 0.5±0.1 | <0.10 | 3.0±0.05 | <0.02 | <0.002 | <0.002 |
3. Physical Properties:
| Sort | Melting Point (℃) | Spec. Gravity (g/cm3) | Tensile Strength (MPa) |
| Sn96.5-Ag3.0-Cu0.5 | 217-219 | 7.40 | 53. |
4. Our Superiority is the Professionalism of our team.
- PCB And PCB Assembly For One-stop Service with Original Components According the BOM.
IC Imported from Digikey / Farnell etc.
- Low Cost with High Quality, Commitment of Quality Assurance.
- For 10 years Experience in PCB Field. ( Our Factory owns advanced
production equipment and experienced technical personnel. )
5. Detailed specification of manufaturing capacity:
| NO | Item | Craft Capacity |
| 1 | Layer | 1-30 Layers |
| 2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
| 3 | Rang of finish baords Thickness | 0.21-7.0mm |
| 4 | Max size of finish board | 900MM*900MM |
| 5 | Minimum Linewidth | 3mil (0.075mm) |
| 6 | Minimum Line space | 3mil (0.075mm) |
| 7 | Min space between pad to pad | 3mil (0.075mm) |
| 8 | Minimum hole diameter | 0.10 mm |
| 9 | Min bonding pad diameter | 10mil |
| 10 | Max proportion of drilling hole and board thickness | 1:12.5 |
| 11 | Minimum linewidth of Idents | 4mil |
| 12 | Min Height of Idents | 25mil |
| 13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| 14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
| 15 | Minimun thickness of soldermask | 10um |
| 16 | Color of silk-screen | White, Black, Yellow ect. |
| 17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| 18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
| 19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
| 20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
| 21 | Thickness of Copper | 0.5-14oz (18-490um) |
6. Quote Requirements for PCB and PCB Assembly project:
- Gerber File and Bom List;
- Quote Quantity;
- Advise your technical requirements for quoting reference;
- Clearly picturers of PCB or PCB Assembly Sample to us for reference;
- Test Mothod for PCB Assembly.
7. T-SOAR Factory Silhouette:
Recommended Products
