YAMAHA YV100XG SMT Assembly Equipment Electronic Component Mounting Machine

YAMAHA YV100XG Electronic Component Mounting Equipment KGB-000 Genuine Used Machine

YAMAHA YV100XG Electronic Component Mounting Equipment KGB-000 Genuine Used Machine

Product features:

High-speed mounting at 0.18 sec/chip (under optimum conditions).

16,200 CPH (0.22sec/chip) achieved under IPC9850 condition.

Mounting accuracy of +/-50 micron (absolute accuracy : μ+3σContinuously all-ball recognition of CSP/BGA, including judgment of flaws and defects.

Accommodation of wide range components, from 0603 to ·31mm QFP.

Ideal for the next generation memory module.

Model:YV100Xg

PCB dimensions

M type : L460xW335mm (Max) / L50xW50mm (Min)

L type : L460xW440mm (Max) / L50xW50mm (Min)

Mounting accuracy

Absolute accuracy (μ+3σ) : +/-0.05mm/CHIP, +/-0.05mm/QFP[when using Yamaha's standard components

Mounting cycle time:

0.18sec/CHIP, 1.7sec/QFP[under optimum conditions], 1608CHIP : 16,200CPH (0.22sec/chip)

[IPC9850 condition]

Components applicable for mounting:

0603~·31mm components, SOP·SOJ, QFP, connector, PLCC, CSP,BGA

FNC head:Allowable height on PCB surface before transport : 4mm max.

Height of components which can be mounted : 15mm.

*Mounting of components with a height of 6.5 to 15mm is possible if certain conditions are met.

Standard head : Allowable height on PCB surface before transport : 6.5mm max.

Height of components which can be mounted : 15mm.

*Mounting of components with a height of 6.5 to 15mm is possible if certain conditions are met.

External dimensions L1,650mmxW1,408mmxH1,850mm

Main unit weight Approx. 1,600kg

1) High-speed and high-precision multi-functional modular placement machine

2) 0.18 seconds/CHIP ultra high speed placement (best condition) 16200CPH (grain/hour)

3) In the IPC9850 state, the patch speed is up to 16200CPH (corresponding to 0.22 seconds/CHIP)

4) Mount 0603 components, the whole precision up to ± 50 microns, full repeat accuracy up to ± 30 microns

5) Wide range of applications, from 0201 (inch) microcomponents to 31mm QFP large components

6) Using 2 high resolution multi-vision digital cameras

7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls

8) The YAMAHA patented flight change nozzle can be selected, which can effectively reduce the machine idle loss

9) The best choice for universal type

10) The Y-axis is driven by high-power servo amplifiers and high-rigidity screw rods at the left and right ends.

This newly developed fully-fixed dual-driver technology accelerates acceleration and co-ordination

through both ends to drive and completes the acceleration function. Reduced positioning time.

Board size M type: L460*W335(MAX)-L50*W50(MIN)

L type: L460*W440(MAX)-L50*W50(MIN)

Mounting Accuracy Absolute Accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP

Mounting speed 0.18 seconds/CHIP 1.7 seconds/QFP,1608/CHIP:16200CPH

Mountable Components 0603-31mm Components, SOP/SOJ/QFP/Connectors/PLCC/CSP/BGA

Dimensions 1650*1408*1900

Total weight 1600KG