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PCB processing-related terms

2026-07-03

PCB processing-related terms:

1. PCB surface treatment methods: tin plating, gold plating, OSP.

2. Several key performance indicators of PCB substrates: glass transition temperature Tg, thermal decomposition temperature Td, thermal expansion coefficient CTE, thermal decomposition time T260, T288.

3. Solder mask covering methods: through-hole cover oil, through-hole window opening, through-hole oil plug, resin hole sealing.

4. Common PCB assembly methods: stamping holes, bridge, V-CUT (V-cut).

5. Common substrates used in PCB processing: FR-4 (glass fiber board substrate), metal substrates (aluminum/ copper), CEM series (composite substrate), polyimide (PI), high-frequency materials (PTFE/Rogers), paper substrate (FR-1/FR-2).

6. FPC (Flexible Printed Circuit Board): composed of flexible substrate, conductive copper foil, adhesive, cover film (protective layer), and reinforcing plate.

7. Baking: making the inner copper foil and semi-cured sheet (PP sheet) firmly adhere together after pressing, without any delamination.

8. Microscopic roughening: through chemical solutions, "chiseling" a dense network of microscopic honeycomb or needle-like structures on the smooth copper surface, greatly increasing the contact area. · Forming a film layer: generating a brown organic metal oxide film on the roughened surface. · Firm bonding: during pressing, the resin flows into the rough surface and undergoes a cross-linking reaction with the oxide film, achieving molecular-level physical and chemical bonding through the "anchoring effect", turning the multi-layer board into a stable whole. 9. Exposure: LDI automatic alignment exposure machine, also known as Laser Direct Imaging exposure machine, is a high-end equipment used in PCB manufacturing for line pattern transfer. Its core feature is that it does not require a photomask, but directly uses a computer-controlled laser beam to "print" the line pattern on the PCB board covered with photosensitive material.

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PCB processing-related terms

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