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Blank PCBs are automatically fed into the production line to start the assembly process.
print solder paste onto PCB pads through stencil to prepare for component soldering.
3D optical inspection to check paste volume, offset, bridging & missing paste, eliminate printing defects in advance.
High-speed mounter accurately place resistors, ICs, connectors and all SMD components on PCBs.
Multi-temperature zone oven melts solder paste to permanently bond electronic components to circuit boards.
Automatic optical inspection to detect missing parts, offset, cold solder, short circuits and other post-reflow defects.