Ping You Industrial Co.,Ltd

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Ping You Industrial Co.,Ltd

FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

    • FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask
    • FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask
  • FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

    Product Details:

    Place of Origin: China
    Brand Name: PY PCB
    Certification: UL,RoHs,SGS,ISO9001-2008
    Model Number: No Solder Mask

    Payment & Shipping Terms:

    Minimum Order Quantity: 10pcs
    Price: Negotiation
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    Detailed Product Description
    PY Led: Aluminium Base Pcb Place Of Origin:: China
    Minimum Order Quantity:: 10000pcs Material Type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    Board Thickness: Board Thickness0.4mm To 7.0mm Copper Thickness: 0.5 OZ To 7.0 OZ

    FR 1 Simple NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

     

    Specifications

     

    Item Requirement Result ACC REJ
    Laminate Type FR-1 FR-1  
    Supplier KB KB  
    Board thickness 1.60±10% mm 1.61-1.65 mm  
    Outer copper foil >=35 um 44.17  
    Inner copper foil / /  
    Warp-twist <= 0.75% 0.68%  
    legend Type KUANG SHUN KUANG SHUN  
    Color Black Black  
    Location CS CS  
    Marking Co.logo / /  
    UL.logo / /  
    Date code / /  
    Marking form / /  
    Location / /  
    Min line width (mil) 7.874 8.1  
    Min line spacing (mil) 6.5 6.3  
    Min ring width (mil) NA NA /  
    Solder Mask Type / /  
    Color / /  
    Thickness / /  
    Pencil Test / /  
    SOLVENT TEST / /  
    TAPE TEST / /  
    Surface treament Lead free HASL OK  
    Special Treament Silk screen / /  
    Location / /  
    Forming V-cut OK  
    Normal Testing Electrical test 100% PCB passed OK  
    Visual inspection IPC-A-600H&IPC-6012B OK  
    Solderability Test 245℃ 5S 1 Cycle OK  
     
    Final inspection report
    Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
    NO Required PTH Actual dimension ACC REJ
    1 2.050±0.05 N 2.050 2.025 2.075 2.050  
    2 3.000±0.05 N 3.000 2.975 3.025 3.000  
                     
    V-CUT Finish dimension (unit: mm): including
    NO Required Dimension (tolerance) Actual dimensin ACC REJ
    1 260.99±0.15 261.01 260.89 261.07 261.10  
    2 230.00±0.15 229.88 229.94 230.05 230.09  
                   
    Reference engineering information
    Hole drill drawing ACC      
    Conductor and film ACC      
    Solder mask and film ACC      
    Legend and film ACC      
    Engineering changing ACC      
     
    E-test Report
    Test Type General   Test Parameter
    Special   Test Votage 250V
    Single mould   Test Curent 100 m A
    Double mould Conducting Resistance 20 M ohm
    Flying probe Test Isolated Resistance 20 M ohm
    Test Points 160 All Open Test Qualified
    Failure  
    The first pass Qty 358 All short Test Qualified
    Failure  
    Reject Qty 2 pcs The first pass Rate 99%
    Mian Dwfect Desciption:
    1 Open Qty 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
    2 Short Qty 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
    3 Con. Defect 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
    4 Isolated Defect 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
    5 Others 2 PCS Repaired Qty 0 PCS Scrap 2 PCS  
    Remark:
     
    Microsection Analysis Report
    purpose & Req Hole wall Trace    
    Copper 20 um Surface copper 35 um
    Nickel 0 um Base copper 11 um
    Au 0 um V/X  
    Tin/Lead 3.92 um    
    Roughness 25 um    
    Hole wall position Unit: um A B C D E F Average Roughness Speciment Location
    Drill Plated
    1 25.600 24.400 24.460 26.100 25.380 25.010 25.158 21.529 21.629  
    2 24.221 23.021 23.081 24.721 24.001 23.631 23.779 19.327 19.427
    3 25.513 24.313 24.373 23.013 25.293 24.923 25.071 17.290 17.390
      Trace Copper Base Copper Solder mask thickness T/L THK Ni THK Au THK Speciment Location
     
    1 44.90 12.95 13.60 5.25      
    2 44.94 12.81 12.08 8.25    
    3 42.66 10.52 15.23 6.25    
    Defects Inspection
      Found NO Found  
    1.Plating crack  
    2.Resion recession  
    3.Plating void  
    4.Delamination  
    5.Smear  
    6.Copper crack  
    7.Blistering  
    8.Interconnection separation  
    9.Laminate void  
    10.wicking  
    11.Nail Heading  
    Reliability Test Report
    NO. Item Requirement Test freqency Test result
    1 Solderability test 245±5℃ 5sec wetting area least 95% 1 ACC
    2 Thermal Stress 288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall 1 ACC
    FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

    Contact Details
    Ping You Industrial Co.,Ltd

    Contact Person: Ms. Becky Lee

    Send your inquiry directly to us (0 / 3000)