Ping You Industrial Co.,Ltd

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FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

  • FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask
  • FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask
FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask
Product Details:
Place of Origin: China
Brand Name: PY PCB
Certification: UL,RoHs,SGS,ISO9001-2008
Model Number: No Solder Mask
Payment & Shipping Terms:
Minimum Order Quantity: 10pcs
Price: Negotiation
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Detailed Product Description
PY Led: Aluminium Base Pcb Place Of Origin:: China
Minimum Order Quantity:: 10000pcs Material Type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board Thickness: Board Thickness0.4mm To 7.0mm Copper Thickness: 0.5 OZ To 7.0 OZ
High Light:

universal pcb board

,

led printed circuit board

FR 1 Simple NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask

 

Specifications

 

Item Requirement Result ACC REJ
Laminate Type FR-1 FR-1  
Supplier KB KB  
Board thickness 1.60±10% mm 1.61-1.65 mm  
Outer copper foil >=35 um 44.17  
Inner copper foil / /  
Warp-twist <= 0.75% 0.68%  
legend Type KUANG SHUN KUANG SHUN  
Color Black Black  
Location CS CS  
Marking Co.logo / /  
UL.logo / /  
Date code / /  
Marking form / /  
Location / /  
Min line width (mil) 7.874 8.1  
Min line spacing (mil) 6.5 6.3  
Min ring width (mil) NA NA /  
Solder Mask Type / /  
Color / /  
Thickness / /  
Pencil Test / /  
SOLVENT TEST / /  
TAPE TEST / /  
Surface treament Lead free HASL OK  
Special Treament Silk screen / /  
Location / /  
Forming V-cut OK  
Normal Testing Electrical test 100% PCB passed OK  
Visual inspection IPC-A-600H&IPC-6012B OK  
Solderability Test 245℃ 5S 1 Cycle OK  
 
Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NO Required PTH Actual dimension ACC REJ
1 2.050±0.05 N 2.050 2.025 2.075 2.050  
2 3.000±0.05 N 3.000 2.975 3.025 3.000  
                 
V-CUT Finish dimension (unit: mm): including
NO Required Dimension (tolerance) Actual dimensin ACC REJ
1 260.99±0.15 261.01 260.89 261.07 261.10  
2 230.00±0.15 229.88 229.94 230.05 230.09  
               
Reference engineering information
Hole drill drawing ACC      
Conductor and film ACC      
Solder mask and film ACC      
Legend and film ACC      
Engineering changing ACC      
 
E-test Report
Test Type General   Test Parameter
Special   Test Votage 250V
Single mould   Test Curent 100 m A
Double mould Conducting Resistance 20 M ohm
Flying probe Test Isolated Resistance 20 M ohm
Test Points 160 All Open Test Qualified
Failure  
The first pass Qty 358 All short Test Qualified
Failure  
Reject Qty 2 pcs The first pass Rate 99%
Mian Dwfect Desciption:
1 Open Qty 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
2 Short Qty 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
3 Con. Defect 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
4 Isolated Defect 0 PCS Repaired Qty 0 PCS Scrap 0 PCS  
5 Others 2 PCS Repaired Qty 0 PCS Scrap 2 PCS  
Remark:
 
Microsection Analysis Report
purpose & Req Hole wall Trace    
Copper 20 um Surface copper 35 um
Nickel 0 um Base copper 11 um
Au 0 um V/X  
Tin/Lead 3.92 um    
Roughness 25 um    
Hole wall position Unit: um A B C D E F Average Roughness Speciment Location
Drill Plated
1 25.600 24.400 24.460 26.100 25.380 25.010 25.158 21.529 21.629  
2 24.221 23.021 23.081 24.721 24.001 23.631 23.779 19.327 19.427
3 25.513 24.313 24.373 23.013 25.293 24.923 25.071 17.290 17.390
  Trace Copper Base Copper Solder mask thickness T/L THK Ni THK Au THK Speciment Location
 
1 44.90 12.95 13.60 5.25      
2 44.94 12.81 12.08 8.25    
3 42.66 10.52 15.23 6.25    
Defects Inspection
  Found NO Found  
1.Plating crack  
2.Resion recession  
3.Plating void  
4.Delamination  
5.Smear  
6.Copper crack  
7.Blistering  
8.Interconnection separation  
9.Laminate void  
10.wicking  
11.Nail Heading  
Reliability Test Report
NO. Item Requirement Test freqency Test result
1 Solderability test 245±5℃ 5sec wetting area least 95% 1 ACC
2 Thermal Stress 288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall 1 ACC
FR 1 NPTH Single Side PCB Printed Circuit Board 1.6mm Thick 1oz No Solder Mask 0

Contact Details
Ping You Industrial Co.,Ltd

Contact Person: Ms. Becky Lee

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