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8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB

8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB

  • 8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB
  • 8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB
  • 8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB
8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB
Product Details:
Place of Origin: ShenZhen
Brand Name: PY
Certification: ISO9001
Model Number: PCB
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD;0.1-1\pcs
Packaging Details: Vacuum packing, high quality carton
Delivery Time: 5-10 work days
Payment Terms: T/T, L/C, D/A, D/P, Western Union, MoneyGram
Supply Ability: Ten thousand square meters per month
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Detailed Product Description
Color: Green,Blue Number Of Plies: 4-6Layer
Copper Thickness:: 4oz Base Material:: FR4
Board Thickness:: 1.0~1.2mm Place Of Origin:: Guangdong, China (Mainland)
High Light:

94V0 Prototype Printed Circuit Board

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8mm Printed Circuit Board

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94V0 Multi Layer PCB

8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB

 

  High precision prototype PCB bulk production
Max Layers 6 layers 6 layers
MIN Line width(mil) 2mil 4mil
MIN Line space(mil) 2mil 4mil
Min via (mechanical drilling) Board thickness≤1.2mm 0.2mm 0.3mm
Board thickness≤2.5mm 0.2mm 0.3mm
Board thickness>2.5mm Aspect Ration≤13:1 Aspect Ration≤13:1
Aspect Ration    
Board thickness MAX 8mm 7mm
MIN 4 layers:0.35mm; 6 layers:0.6mm;
MAX Board size 550*1200mm 550*1200mm
Max copper thickness 1oz 2oz
Immersion Gold/
Gold Plated Thickness

Gold finger:Au,1—150u”
 
Hole copper thick 25um 1mil 25um 1mil
Tolerance Board thickness thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance ≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
Impedance ±10% ±10%
MIN Solder mask bridge  0.05mm  0.03mm
Plugging Vias capability  0.25mm  0.70mm

 

The name of the circuit board is: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper plate, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printing (copper etching technology) circuit board and so on.The circuit board makes the circuit miniaturized and intuitionized, which plays an important role in the mass production of fixed circuit and the optimization of electrical layout.Printed Circuit Board, or Flexible Printed Circuit Board, is a type of Printed Circuit Board made of polyimide or polyester film with high reliability and excellent flexibility.With high wiring density, light weight, thin thickness, good bending characteristics.And reechas, Soft and hard combination plate - the birth and development of FPC and PCB, gave birth to the Soft and hard combination plate this new product.Therefore, the combination of hard and soft board, is the flexible circuit board and hard circuit board, after pressing and other processes, according to the relevant process requirements combined together, the formation of a FPC characteristics and PCB characteristics of the circuit board.

8mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB 08mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB 18mm Fr4 94V0 Prototype Printed Circuit Board Multi Layer PCB 2

FR-1: Flame retardant copper-clad phenolic paper laminate.IPC4101 detail specification No. 02;Tg N/A;
Circuit board
Circuit board
FR-4:1) Flame retardant copper-clad epoxy E glass fiber cloth laminate and adhesive sheet material.IPC4101 detail specification number 21;Tg 100 ℃ or higher;
2) Flame retardant copper-clad modified or unmodified epoxy E fiberglass cloth laminates and adhesive materials.IPC4101 detail specification number 24;Tg 150 ℃ ~ 200 ℃;
3) Flame retardant copper-clad epoxy /PPO glass cloth laminate and its adhesive material.IPC4101 detail specification number 25;Tg 150 ℃ ~ 200 ℃;
4) Flame retardant copper-clad modified or unmodified epoxy glass cloth laminate and adhesive material.IPC4101 detail specification number 26;Tg 170 ℃ ~ 220 ℃;
5) Flame retardant copper-clad epoxy E glass cloth laminate (for catalytic addition method).

 

Electromagnetic compatibility

(EMC) refers to the ability of electronic equipment to work in a coordinated and effective manner in various electromagnetic environments.The purpose is to make the electronic equipment can suppress all kinds of external interference, so that the electronic equipment can work normally in a specific electromagnetic environment, and at the same time can reduce the electronic equipment itself to other electronic equipment electromagnetic interference.
1, choose a reasonable wire width because of the impact of the transient current on the printed lines of the PCB circuit board is mainly caused by the inductance component of the printed wire, so the inductance of the printed wire should be reduced as far as possible.
2, USES the correct wiring strategy USES the equal linear conductor inductance can be reduced, but the mutual inductance between conductor and distributed capacitance increases, the layout of permitting, had better use well glyph structure network cabling, specific side lateral approach is printed circuit board wiring, the other side vertical wiring, then at the cross hole is connected with metallized hole.
3, in order to inhibit the cross-talk between PCB circuit board wires, in the design of wiring should try to avoid long-distance equal wiring, as far as possible to open the distance between the line and the line, signal line and ground wire and power line as far as possible do not cross.A printed line connected to the ground between some signal lines which are very sensitive to interference can effectively suppress crosstalk.

 

Downstream demand is driving growth


The United States, Europe and other major producers cut production or product structure adjustment brought about market space
International industrial transfer brings new technology and management of the rapid development of electronic information industry, the export growth of 40-45%, but PCB industry lags behind the overall electronic information industry growth range, the production of multilayer board and HDI board is far behind the market, need to rely heavily on imports, PCB industry still has a lot of space for development
Manufacturers should look for market segments and products with high gross profit, and transition to higher-order products, such as soft panels, hard-soft combined panels, thick copper panels, photoelectric XY control boards, source boards of TFT panels, automotive boards, memory boards, memory module boards, and PCB boards above 10 layers, which have more opportunities.
threat

 

The upward pressure on raw materials and energy prices
The main raw material for printed circuit board production, including copper clad, copper foil, half cured films, chemical liquid, anode copper/tin/nickel, dry film, printing ink, etc., in addition, the printed circuit board production and consumption of electric energy, precious metals and oil, coal based energy prices rising sharply also makes the copper clad, copper foil printed circuit board industry such as main raw materials and energy prices are up significantly, which brings to the printed circuit board production enterprise cost pressure.
Price pressures in downstream industries


China's PCB industry has a high degree of market competition, the scale of a single manufacturer is not large, pricing power is limited.With the expansion of the downstream industry capacity and the intensification of competition, the price competition in the downstream industry is increasingly fierce, and the control of product cost is the focus of many manufacturers.In this case, the cost pressure of the downstream industry may be partially passed to the printed circuit board industry, and the obstacles to the price increase of the printed circuit board are greater.
RMB appreciation risk: impact on exports, impact on foreign orders mainly enterprises
Industry surplus supply, the need to further integrate the risk
Solve environmental issues and RoHS standards
The issuance of 3G licences has been slow

 

Raw material price increases PCB can not raise the price, and the periodic drop, immediately attracted the downstream industry a reduction requirements.PCB structural supply and demand imbalance.The middle and high-end enterprises are dominated by foreign capital, Hong Kong capital, Taiwan capital and a few state-owned enterprises, while domestic enterprises are at a financial and technological disadvantage.Low-end refers to small factories that operate irregularly, because of less investment in equipment and environmental protection, but form a cost advantage.In the middle of the level of the formation of intensive manufacturers, two sides of the attack, the competition is more intense.Some manufacturers rebuild and expand, the market is difficult to digest quickly, and the price war is becoming more and more intense
The Chinese government strictly formulates and implements regulations on pollution control, which involve the PCB industry and forbid the construction and expansion of PCB plants. The regulations on electroplating plants are very strict
Workers' wages have risen rapidly.
Circuit board sales revenue distribution
Circuit board sales revenue distribution


Periodic Analysis and Forecast of PCB in China:


The periodicity of PCB has become stable. It used to be affected by the periodicity of computer, but its products are diversified.It will not cause the whole market to decline because the production and sales of one or two electronic products are not flourishing.
The periodicity of printed circuit board industry is not obvious, mainly with macroeconomic fluctuations.Since the 1990s, China's printed circuit board industry has maintained a rapid growth of about 30% for many years.

From 2001 to 2002, the growth rate of China's printed circuit board industry declined considerably due to the influence of the slowdown of world economic growth and other factors. The output value of the industry in 2001 and 2002 increased less than 5%.
After 2003, with the recovery of the global economy and the emergence and wide application of new electronic products, the demand for printed circuit board (PCB) again appeared rapid growth, and the output value of China's printed circuit board industry recovered to an annual growth rate of about 30%.In 2005, the output value of China's printed circuit board industry increased by about 31.4%.

Growth slowed in 2007 and the recovery from the second half of 2003 appeared to have ended in 2006, but China's growth can still be achieved by capacity transfer from developed countries.


In recent years, China's fiberglass industry (18.83,0.56,3.07%) has been developing vigorously, and its high speed development is driven by advanced pool drawing technology.China's fiberglass industry has completely broken the foreign monopoly on advanced fiberglass drawing technology and main equipment, and fully realized the overall strategic goal of localization of complete sets of technology and equipment with Chinese characteristics and independent intellectual property rights, thus driving the great development of the fiberglass industry.


In the past two years, the number of kilns and the production capacity in China have been increasing at a rate of more than 30%, and the production capacity of electronic fiberglass fabric has also been developing at a corresponding speed.China's electronic glass fiber industry aims at the world's advanced level, develops the advanced productivity of non-alkali pool kiln wiredrawing, builds the high-level non-alkali pool kiln wiredrawing production line and glass fiber product production line, continues to reduce the backward production capacity of ball process wiredrawing process, and realizes the conformity of product standards with international product standards.As a powerful driving force, the pool drawing has promoted the upgrading of production technology in China's glass fiber industry, and the independent innovation of domestic equipment has promoted the rapid growth of the glass fiber industry.

 

Percentage of board type
Electronic fiberglass cloth for copper clad board is developing to thin type, to meet the requirements of short, small, light, thin, high density assembly of electronic products, and promote the development of circuit board to multi-layer, ultra-multi-layer.Before 2000, the mainland of China's copper clad plate industry used 7628 cloth (belonging to thick cloth), accounting for 80% of the total consumption, the use of 2116 and 1080 cloth (belonging to thin cloth) accounted for 20% of the total consumption has developed to thick cloth accounted for 60%, thin cloth accounted for 40%.


At present, in addition to 2116 and 1080, there are 8 specifications such as 3313, 2313, 2113, 2112, 1505, 1500, 1086 and 1065 for the thin electronic cloth used by the copper clad plate manufacturers in the mainland of China, and 2 specifications such as 1078 and 106 for the very thin electronic cloth.Therefore, it is urgent for electronic cloth manufacturers to accelerate the research and development of thin electronic cloth.

 

 

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Contact Person: PYPCB-Vera

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